Underfill adhesive for IC packaging is a high-fluidity, high-filling capacity adhesive material specially used in the semiconductor chip packaging process. Its main function is to form a filling layer between the chip and the substrate to enhance the mechanical strength, thermal stability, and electrical performance of the chip package.

The global Underfill for IC Packaging market size is projected to grow from US$ 390 million in 2024 to US$ 567 million in 2030; it is expected to grow at a CAGR of 6.4% from 2024 to 2030.

The report by ReportPrime looks at past sales and reviews total world Underfill for IC Packaging sales in 2023, providing a comprehensive analysis by region and market sector of projected Underfill for IC Packaging sales for 2024 through 2030.

This Insight Report provides a comprehensive analysis of the global Underfill for IC Packaging landscape and highlights key trends related to:

• Product segmentation
• Company formation
• Revenue
• Market share
• Latest development
• M&A activity

This report also analyzes the strategies of leading global companies with a focus on Underfill for IC Packaging portfolios and capabilities, including:

• Market entry strategies
• Market positions
• Geographic footprints

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Underfill for IC Packaging and breaks down the forecast by:

• Type
• Application
• Geography
• Market size

Key regions include:

• Americas
• APAC
• Europe
• Middle East & Africa

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, and market penetration:

• Henkel
• Won Chemical
• NAMICS
• Resonac
• Panasonic
• MacDermid Alpha
• Shin-Etsu
• Sunstar
• Fuji Chemical
• Zymet
• Shenzhen Dover
• Threebond
• AIM Solder
• Darbond
• Master Bond
• Hanstars
• Nagase ChemteX
• LORD Corporation
• Asec Co., Ltd.
• Everwide Chemical
• Bondline
• Panacol-Elosol
• United Adhesives
• U-Bond
• Shenzhen Cooteck Electronic Material Technology

Key Questions Addressed in this Report:

1. What is the 10-year outlook for the global Underfill for IC Packaging market?
2. What factors are driving Underfill for IC Packaging market growth, globally and by region?
3. Which technologies are poised for the fastest growth by market and region?
4. How do Underfill for IC Packaging market opportunities vary by end market size?
5. How does Underfill for IC Packaging break out by Type, by Application?